Carbon-based Thermal Management Materials: X-Cooler®
碳基散熱片
為AI與5G世代打造的高效熱管理解決方案
在高速運算與高功率密度的裝置中，熱管理是決定系統性能與壽命的關鍵因素。AI模型訓練、GPU運算、5G模組、電動車電控系統等應用皆面臨劇烈熱負載挑戰。若無有效散熱解決方案，將導致元件效能衰退、壽命縮短，甚至系統故障。
TCMC專注於開發高導熱石墨烯散熱片，以碳基材料的導熱潛力為基礎，打造兼具導熱效率、結構穩定與輕量化的下一代熱管理解決方案。
技術優勢：
- 高導熱率設計：提供橫向(X-Y軸)與垂直(Z軸)散熱選項，對應不同裝置的散熱方向需求
- 厚度與結構客製化：可依客戶應用調整總厚度、層數堆疊與複材結構，兼顧導熱性與機械強度
- 柔性與貼合性佳：適用於不規則或曲面元件，維持高接觸效率與熱界面穩定性
- 尺寸穩定、可模切加工：支援各類模組尺寸與複雜形狀需求
應用領域：
- AI伺服器、GPU/CPU模組
- 5G無線通訊裝置與基地台
- 電動車電池模組與熱控系統（BMS）
- 高密度LED照明與感測器元件
- 消費性電子（智慧手機、穿戴裝置）
TCMC可依不同終端需求提供橫向或垂直導熱型散熱片，並提供片材、貼合型、或複合材料形式的客製方案，協助客戶在空間受限與性能要求兼具的條件下，打造穩定可靠的熱管理解決方案。
X-Cooler® High Thermal Conductivity Heat Spreader
(Horizontal direction heat transfer)
Spreads heat laterally within the sheet, useful for devices with surface-based heat sources.
(X-Y direction)
X-Cooler® Compressible Thermal Interface Materials
(TIM; vertical direction heat transfer)
Conducts heat upwards, ideal for components with concentrated heat sources requiring efficient cooling.
(Z direction)
X-Cooler®: High Thermal Conductivity Carbon-based Heat Spreader
| Type | X-25 | X-40 | X-50 | X-70 | X-90 | X->110 | ||
| Thickness (μm) | 23±2 | 32±2 | 50±5 | 70±5 | 90±5 | Customized | ||
| Density (g/cm3) | ≧2.0 | ≧2.0 | > 2.0 | > 2.0 | > 2.0 | > 2.0 | ||
| Thermal Conductivity | In-plane | 1,600±100 | 1,600±100 | 1,500 ± 100 | 1,300 ± 100 | 1,200 ± 100 | 1,200 ± 100 | |
| (W/mK) | Through-plane | 3 – 5 | 3 – 5 | 3 – 5 | 3 – 5 | 3 – 5 | 3 – 5 | |
| Thermal Diffusivity (mm2/s) | > 800 | > 800 | > 800 | > 800 | > 750 | > 750 | ||
| Specific Heat Capacity (J/gK) | 0.85 | 0.85 | 0.85 | 0.85 | 0.85 | 0.85 | ||
| Electrical Conductivity (S/cm) | > 12,000 | > 12,000 | > 12,000 | > 12,000 | > 10,000 | > 8,000 | ||
| Working Temperature (℃) | -40 ~ 400 | |||||||
| Standard Size | Roll | 120 mm width, | Customized | |||||
| 100 or 200 (under 100 μm)-meter per roll | ||||||||
| Sheet | 120 X 250 mm | |||||||
| Testing Conditions | RoHS, HAST, PCT, HTST (1,000hrs@150℃), | |||||||
| TCT(-55~125℃,40mins, 1,000 cycles) | ||||||||
High Thermal Conductivity
High thermal conductivity within the plane of the sheet, ideal for spreading heat laterally.
Lightweight Design
Lightweight and flexible, suitable for integration into compact electronic devices.
Even Heat Distribution
Effective in devices with heat sources spread across the surface, ensuring even heat distribution.
| Type | Thermal Sheet Only | Adhesive Types | ||||||||||||||||||
| P | R | RA | RB | RC | ||||||||||||||||
| Structure |
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| Features |
| Backing Released on One Side of the Film | One-side Insulated Adhesive Tape | Two-sides Insulated Adhesive Tape |
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| Products Form | Sheet | Sheet | Sheet | Sheet | Sheet | |||||||||||||||
X-Cooler
Adhesive ( 3-5 μm)
Release Film
Insulated Tape ( 3-5 μm)
Easy integration into customer products, offering a variety of specifications to accommodate various applications.
X-Cooler® Graphene Thermal Interface Materials (TIM)
Graphene Thermal Interface Materials (TIMs) represent a cutting-edge solution in thermal management, characterized by extraordinary properties that set them apart from traditional materials.
In electronics, graphene TIMs are revolutionizing heat dissipation for processors, smartphones, and computing systems. The automotive and aerospace industries are exploring its potential for advanced thermal management solutions. Battery technologies benefit from graphene’s ability to improve charging efficiency and thermal stability, potentially extending device lifespans.
ThermaComp™- EVF
High-compressibility TIM optimized for demanding heat and electrical management applications.
ThermaComp™- PMO
High-compressibility and enhanced mechanical strength TIM with low electrical conductivity (<100 S/cm), designed for applications requiring efficient heat dissipation with minimal electrical conduction.
| EVF | PMO | |
| Thickness (μm) | 75, 100, 400 | 100, 200 |
| Weight (mg/cm2) | 1.7 – 8.5 | 2.0 – 4.5 |
| Compressibility (%@200kPa) | > 50 | > 40 |
| Thermal Resistance (Kcm2/W) | < 0.38 | < 0.38 |
| In-plane Thermal Conductivity (W/mK) (depends on the compressibility) | > 200 | > 200 |
| Thermal Diffusivity (mm2/s) | > 200 | > 200 |
| Specific Heat Capacity (J/gK) | 0.85 | 0.85 |
| Tensile Strength (MPa) | > 1.0 | > 2.0 |
| Electrical Conductivity (S/cm) | > 2,000 | < 100 |
| Working Temperature (°C) | -40 ~ 400 | -40 ~ 400 |
| Standard Size | 150 x 280 mm (Customized available) | 70 x 70 mm (Customized available) |
| Key Features | Low thermal resistivity, High compressibility | Low thermal resistivity, High compressibility, enhanced mechanical strength |
低熱阻係數
石墨烯卓越的熱導性遠超傳統導熱介面材料（TIM），可有效降低熱阻，實現更快速的熱能傳導與散熱效率。
優異的導熱介面
石墨烯導熱片能有效連接發熱源與大型散熱器或冷卻系統，提供穩定且高效的導熱通道。
垂直導熱能力
特別適用於具集中熱源的元件，實現高效率的垂直熱散傳導，提升整體模組散熱表現。
化學穩定與耐久性
石墨烯展現出色的化學穩定性與抗劣化能力，能長時間維持材料性能與可靠性，適用於嚴苛操作環境。
Carbon-based thermal films:
Innovative, cost-effective, and highly effective in heat management.
- Automotive
- High-Performance Computing
- Consumer Electronics
- Aerospace
- Data Center
- Industrial machinery
- Power generation
- Smart Phones
- Servers
